Engineering & Materials Science
Cracks
100%
Crack propagation
67%
Crack tips
62%
Indentation
52%
Glass
47%
Photoelasticity
44%
Stress intensity factors
42%
Microscopic examination
38%
Carbon fiber reinforced plastics
29%
Polybutenes
27%
Thermal load
20%
Stress analysis
20%
Creep
20%
Fatigue of materials
19%
Laminates
19%
Thermoplastics
19%
Holography
18%
CCD cameras
18%
Energy release rate
17%
Temperature
16%
Polyamides
16%
Fatigue crack propagation
15%
Compliance
13%
Constitutive equations
13%
Polymers
13%
Resins
11%
Mechanical properties
11%
Boundary conditions
11%
Fibers
10%
Delamination
10%
Diamond like carbon films
10%
Polarimeters
10%
Fracture mechanics
10%
Birefringence
9%
Acoustic emissions
9%
Plastic deformation
8%
Strain rate
8%
Finite element method
8%
Displacement measurement
8%
Composite materials
8%
Fiber reinforced plastics
8%
Corrosion fatigue
8%
Martensitic stainless steel
8%
Anisotropy
8%
Plastics
8%
Interferometry
8%
Cyclic loads
7%
Steel
7%
Heat generation
7%
Stress corrosion cracking
7%
Chemical Compounds
Displacement
42%
Plate Glass
40%
Fatigue Strength
34%
Photoelasticity
27%
Delamination
25%
Velocity
25%
Plate Like Crystal
25%
Crack Propagation
24%
Simulation
23%
Fracture Mechanics
23%
Crack Initiation
21%
Strain
20%
Viscoelastic Substance
17%
Mechanics
17%
Acoustic Emission
15%
Surface
12%
Fatigue Limit
12%
Corrosion Fatigue
10%
Creep
10%
Coalescence
9%
Polarimetry
9%
Fiber
9%
Interferometry
9%
Plastic Deformation
9%
Stress Corrosion Cracking
8%
Solder
8%
Reinforced Plastic
8%
Birefringence
7%
Energy
7%
Polyamide
6%
Poisson Ratio
6%
Diamond
6%
Grain Size
6%
X-Ray
5%
Creep Compliance
5%
White
5%
Entropy
5%
Creep Behavior
5%
Physics & Astronomy
cracks
34%
microscopy
14%
photoviscoelasticity
13%
holography
13%
variable amplitude loading
12%
stress intensity factors
12%
crack opening displacement
10%
steels
10%
high speed
10%
mechanical properties
10%
stress distribution
10%
photoelasticity
9%
Palmgren-Miner rule
9%
fatigue life
8%
cycles
8%
evaluation
8%
crack tips
8%
displacement measurement
8%
stress analysis
8%
polarimetry
7%
crack initiation
7%
indentation
7%
solders
7%
image reconstruction
7%
convolution integrals
6%
alkalies
6%
coalescing
6%
photographs
6%
birefringence
6%
fatigue tests
6%
histories
5%
diamonds
5%
recording
5%