Engineering & Materials Science
Thin films
100%
Bismuth
77%
Ferroelectric materials
46%
Substrates
43%
Remanence
38%
Buffer layers
33%
Magnetron sputtering
32%
Optical properties
31%
Ferroelectric thin films
30%
Metals
24%
Optical waveguides
23%
Silicon oxides
22%
Silicon wafers
22%
Permittivity
19%
Silicon
18%
Fabrication
18%
Decomposition
18%
Alcohols
17%
Temperature
15%
Silicates
14%
Leakage currents
14%
Liquids
14%
Physical properties
14%
Fermi level
13%
Molecular orbitals
13%
Semiconductor materials
13%
Refractive index
12%
Proton beams
12%
Electroluminescence
12%
Thick films
11%
Dielectric properties
11%
Doping (additives)
10%
Hysteresis
10%
Current density
10%
Sputtering
10%
Electric potential
9%
Oxide films
9%
Copper
9%
Diffraction
9%
Lattice constants
9%
Polyimides
9%
Platinum
9%
Surface morphology
8%
Ferroelectricity
8%
Deposition rates
8%
Ink
8%
Thermodynamic stability
8%
Cathodes
7%
Wavelength
7%
Luminance
7%
Physics & Astronomy
titanates
61%
bismuth
61%
preparation
46%
thin films
43%
wafers
22%
silicon
19%
decomposition
17%
magnetron sputtering
16%
fabrication
15%
metals
14%
buffers
12%
permittivity
11%
polarization
11%
siloxanes
10%
optical properties
10%
supplying
9%
silicates
9%
characterization
8%
inks
8%
silicon oxides
8%
alcohols
8%
polyimides
8%
proton beams
7%
electroluminescence
7%
leakage
7%
optical waveguides
7%
printing
7%
platinum
7%
dielectric properties
7%
thick films
7%
hysteresis
7%
interlayers
7%
oxide films
7%
ceramics
7%
thermal stability
6%
temperature
6%
liquid phases
6%
perovskites
6%
titanium
6%
physical properties
6%
grain size
5%
luminance
5%
film thickness
5%
current density
5%
ferroelectricity
5%
molecular orbitals
5%
Chemical Compounds
Liquid Film
37%
Magnetron Sputtering
15%
Leakage Current
13%
Polarization
13%
Interface Trap
13%
Dielectric Constant
12%
Trap Density Measurement
11%
Buffer Solution
11%
Hysteresis
11%
Optical Property
11%
Silicon Oxide
9%
Dielectric Property
9%
Fermi Level
9%
Perylene
8%
Voltage
8%
Electric Field
8%
Electroluminescence
8%
Siloxane
8%
Capacitor
8%
Ink
7%
Current Density
7%
Polyimide Macromolecule
7%
Dielectric Material
6%
Doping Material
6%
Decomposition
6%
Platinum
5%
Cathode
5%
Pyrolysis
5%
Thermal Stability
5%