Engineering & Materials Science
Fatigue of materials
100%
Soldering alloys
91%
Thermal fatigue
52%
Fatigue crack propagation
40%
Silver nanoparticles
31%
Temperature
29%
Lead-free solders
26%
Eutectics
26%
Creep
25%
Cracks
22%
Finite element method
21%
Bismuth
20%
Silver
19%
Coarsening
18%
Semiconductor materials
16%
Fatigue testing
16%
Grain boundaries
16%
Strain energy
15%
Strain hardening
14%
Crack initiation
13%
Polyimides
13%
Ductility
13%
Fatigue damage
13%
Intermetallics
12%
Crack propagation
12%
Thermal cycling
12%
Power semiconductor devices
11%
Single crystals
11%
Plastic deformation
10%
Tin
10%
Copper
10%
Strain rate
10%
Sintering
9%
Microstructure
7%
Lead
7%
Thin films
6%
Fans
6%
Solid solutions
6%
Constitutive equations
6%
Adhesives
6%
Hot Temperature
6%
Crack tips
5%
Crystals
5%
Phenolic resins
5%
Energy release rate
5%
Printed circuit boards
5%
Dielectric films
5%
Polymers
5%
Chemical Compounds
Solder
90%
Crack Propagation
67%
Thermal Fatigue
56%
Alloy
42%
Creep
34%
Eutectics
22%
Strain Energy
21%
Semiconductor
20%
Strain
20%
Grain Boundary
18%
Strain Hardening
15%
Crack Initiation
14%
Mechanical Fatigue
13%
Ductility
13%
Intermetallic Compound
12%
Plastic Deformation
11%
Thermal Cycling
10%
Microstructure
9%
Nanoparticle
9%
Sintering
8%
Polyimide Macromolecule
8%
Single Crystalline Solid
7%
Shear
7%
Time
7%
Resistance
6%
Volume
6%
Shear Stress
6%
Delamination
6%
Fracture Mechanics
5%
Nuclear Power
5%
Strength
5%
Dielectric Film
5%
Fracture Energy
5%
Physics & Astronomy
fatigue life
83%
solders
69%
thermal fatigue
42%
crack propagation
31%
cycles
30%
chips
14%
cracks
14%
silver
12%
bismuth
12%
exponents
11%
fatigue tests
11%
strain hardening
10%
temperature
10%
flux density
10%
evaluation
10%
intermetallics
9%
ductility
8%
predictions
8%
plastic deformation
8%
eutectics
7%
eutectic alloys
7%
nanoparticles
7%
damage
6%
crack tips
6%
constitutive equations
6%
endurance
5%
dwell
5%
Coffin-Manson law
5%
crack initiation
5%
microstructure
5%
single crystals
5%
shear stress
5%
sintering
5%
mineral oils
5%
creep properties
5%