A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki; S.Yamazaki S.Yamazaki; T.Usami T.Usami; Y.Tsuchiya Y.Tsuchiya; N.Ito N.Ito; T.Onodera T.Onodera; Y.Hayash Y.Hayash; K.Ueno K.Ueno; H.Gomi H.Gomi; Kazuyoshi Ueno

A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki, S.Yamazaki S.Yamazaki, T.Usami T.Usami, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, T.Onodera T.Onodera, Y.Hayash Y.Hayash, K.Ueno K.Ueno, H.Gomi H.Gomi, Kazuyoshi Ueno

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Original language	English
Pages (from-to)	777-780
Journal	1997 IEDM Technical Digest
Publication status	Published - 1997 Dec 1

Cite this

@article{43c796eab01248a5a66dc7f67b67150b,

title = "A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water",

author = "H.Aoki H.Aoki and S.Yamazaki S.Yamazaki and T.Usami T.Usami and Y.Tsuchiya Y.Tsuchiya and N.Ito N.Ito and T.Onodera T.Onodera and Y.Hayash Y.Hayash and K.Ueno K.Ueno and H.Gomi H.Gomi and Kazuyoshi Ueno",

year = "1997",

month = dec,

day = "1",

language = "English",

pages = "777--780",

journal = "1997 IEDM Technical Digest",

}

TY - JOUR

T1 - A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

AU - H.Aoki, H.Aoki

AU - S.Yamazaki, S.Yamazaki

AU - T.Usami, T.Usami

AU - Y.Tsuchiya, Y.Tsuchiya

AU - N.Ito, N.Ito

AU - T.Onodera, T.Onodera

AU - Y.Hayash, Y.Hayash

AU - K.Ueno, K.Ueno

AU - H.Gomi, H.Gomi

AU - Ueno, Kazuyoshi

PY - 1997/12/1

Y1 - 1997/12/1

M3 - Article

SP - 777

EP - 780

JO - 1997 IEDM Technical Digest

JF - 1997 IEDM Technical Digest

ER -