A degradation-free Cu/HSQ damascene technology using metal mask patterning and post-CMP cleaning by electrolytic ionized water

H.Aoki H.Aoki, S.Yamazaki S.Yamazaki, T.Usami T.Usami, Y.Tsuchiya Y.Tsuchiya, N.Ito N.Ito, T.Onodera T.Onodera, Y.Hayash Y.Hayash, K.Ueno K.Ueno, H.Gomi H.Gomi, Kazuyoshi Ueno

Research output: Contribution to journalArticlepeer-review

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)777-780
Journal1997 IEDM Technical Digest
Publication statusPublished - 1997 Dec 1

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