Original language | English |
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Pages (from-to) | 27-28 |
Journal | 1995 Symposium on VLSI Technology Digest of Technical Papers |
Publication status | Published - 1996 Jun 1 |
A half-micron pitch Cu interconnection technology
K.Ueno K.Ueno, K.Ohto K.Ohto, K.Tsunenari K.Tsunenari, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review
1
Citation
(Scopus)