A New Polyimide Siloxane Film for Interlayer Dielectrics in Sub-micron Multilevel Interconnection

T.Homma T.Homma, K.Eguchi K.Eguchi, Y.Numasawa Y.Numasawa, T.Kikkawa T.Kikkawa, Y.Hokari Y.Hokari, K.Hamano K.Hamano, Tetsuya Homma

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)279-285
JournalProceedings of 5th IEEE VLSI Multilevel Interconnection Conference
Publication statusPublished - 1988 Jun 13

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