A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Satoshi Kaneko; Yo Takahahsi; Toshio Sudo; Akihiro Kanno; Akiko Sugimmoto; Fujio Kuwako

doi:10.1109/EDAPS.2008.4736002

A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Satoshi Kaneko, Yo Takahahsi, Toshio Sudo, Akihiro Kanno, Akiko Sugimmoto, Fujio Kuwako

Electrical Engineering and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high- density thin-film decoupling capacitance inside the package.

Original language	English
Title of host publication	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Publisher	IEEE Computer Society
Pages	73-76
Number of pages	4
ISBN (Print)	9781424426331
DOIs	https://doi.org/10.1109/EDAPS.2008.4736002
Publication status	Published - 2008 Jan 1
Event	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of Duration: 2008 Dec 10 → 2008 Dec 12

Publication series

Name	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Conference

Conference	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Country/Territory	Korea, Republic of
City	Seoul
Period	08/12/10 → 08/12/12

ASJC Scopus subject areas

Renewable Energy, Sustainability and the Environment
Management, Monitoring, Policy and Law
Energy(all)
Energy Engineering and Power Technology
Fuel Technology
Modelling and Simulation
Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2008.4736002

Cite this

Kaneko, S., Takahahsi, Y., Sudo, T., Kanno, A., Sugimmoto, A., & Kuwako, F. (2008). A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 73-76). [4736002] (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). IEEE Computer Society. https://doi.org/10.1109/EDAPS.2008.4736002

A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. / Kaneko, Satoshi; Takahahsi, Yo; Sudo, Toshio et al.
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. IEEE Computer Society, 2008. p. 73-76 4736002 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kaneko, S, Takahahsi, Y, Sudo, T, Kanno, A, Sugimmoto, A & Kuwako, F 2008, A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. in 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings., 4736002, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings, IEEE Computer Society, pp. 73-76, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, Seoul, Korea, Republic of, 08/12/10. https://doi.org/10.1109/EDAPS.2008.4736002

Kaneko S, Takahahsi Y, Sudo T, Kanno A, Sugimmoto A, Kuwako F. A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. IEEE Computer Society. 2008. p. 73-76. 4736002. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). doi: 10.1109/EDAPS.2008.4736002

Kaneko, Satoshi ; Takahahsi, Yo ; Sudo, Toshio et al. / A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. IEEE Computer Society, 2008. pp. 73-76 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

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A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package

Abstract

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