Adhesive bonding for integrating laser diode and optical isolator

Hideki Yokoi; Isamu Myouenzono; Norihiko Ichishima

doi:10.1109/LTB-3D.2012.6238057

Adhesive bonding for integrating laser diode and optical isolator

Hideki Yokoi, Isamu Myouenzono, Norihiko Ichishima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Integrating a laser diode and an optical isolator with a Si guiding layer was investigated by means of adhesive bonding.

Original language	English
Title of host publication	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Number of pages	1
DOIs	https://doi.org/10.1109/LTB-3D.2012.6238057
Publication status	Published - 2012 Aug 15
Event	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 - Tokyo, Japan Duration: 2012 May 22 → 2012 May 23

Publication series

Name	Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012

Conference

Conference	2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012
Country/Territory	Japan
City	Tokyo
Period	12/5/22 → 12/5/23

ASJC Scopus subject areas

Computer Graphics and Computer-Aided Design
Computer Vision and Pattern Recognition

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10.1109/LTB-3D.2012.6238057

Cite this

Yokoi, H., Myouenzono, I., & Ichishima, N. (2012). Adhesive bonding for integrating laser diode and optical isolator. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 [6238057] (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). https://doi.org/10.1109/LTB-3D.2012.6238057

Adhesive bonding for integrating laser diode and optical isolator. / Yokoi, Hideki; Myouenzono, Isamu; Ichishima, Norihiko.
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. 6238057 (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yokoi, H, Myouenzono, I & Ichishima, N 2012, Adhesive bonding for integrating laser diode and optical isolator. in Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012., 6238057, Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012, Tokyo, Japan, 12/5/22. https://doi.org/10.1109/LTB-3D.2012.6238057

Yokoi H, Myouenzono I, Ichishima N. Adhesive bonding for integrating laser diode and optical isolator. In Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012. 2012. 6238057. (Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012). doi: 10.1109/LTB-3D.2012.6238057

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title = "Adhesive bonding for integrating laser diode and optical isolator",

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author = "Hideki Yokoi and Isamu Myouenzono and Norihiko Ichishima",

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Adhesive bonding for integrating laser diode and optical isolator

Abstract

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ASJC Scopus subject areas

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