Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa; K.Sawada K.Sawada; T.Sudo T.Sudo; Toshio Sudo

Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -

T.Nakazawa T.Nakazawa, K.Sawada K.Sawada, T.Sudo T.Sudo, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	231-236
Journal	IMC
Publication status	Published - 1994 May 15

Cite this

@article{fd400da7042544d4bd5a9f29488a5a1d,

title = "Analysis of Package Cracking During Reflow Soldering Process ? The Establishment of a Cracking Estimation Equation by Using The Stress Intensity Factor -",

author = "T.Nakazawa T.Nakazawa and K.Sawada K.Sawada and T.Sudo T.Sudo and Toshio Sudo",

year = "1994",

month = may,

day = "15",

language = "English",

pages = "231--236",

journal = "IMC",

}