TY - GEN
T1 - Anti-resonance peak damping of PDN impedance by on-board snubber circuits
AU - Iijima, You
AU - Matsumura, Masataka
AU - Sudo, Toshio
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Simultaneous switching noise (SSN) is a serious design issue to stabilize logic operation and to reduce electromagnetic interference (EMI) in advanced CMOS circuits and systems. Ringing frequency observed in the SSN waveforms is strongly related to the anti-resonance peak frequency of total PDN impedance. In this paper, on-board snubber (RC series circuit) was investigated to improve power supply integrity in a FPGA (Field Programmable Gate Array) board. The on-board snubber circuits was added just at the beneath of the power supply terminals of the FPGA to effectively suppress the anti-resonance peak of the total PDN impedance. Design space to damp the anti-resonance peak was examined. In particular, the values of on-board capacitance and resistance of snubber circuit has been examined by using circuit analysis tool and field solver.
AB - Simultaneous switching noise (SSN) is a serious design issue to stabilize logic operation and to reduce electromagnetic interference (EMI) in advanced CMOS circuits and systems. Ringing frequency observed in the SSN waveforms is strongly related to the anti-resonance peak frequency of total PDN impedance. In this paper, on-board snubber (RC series circuit) was investigated to improve power supply integrity in a FPGA (Field Programmable Gate Array) board. The on-board snubber circuits was added just at the beneath of the power supply terminals of the FPGA to effectively suppress the anti-resonance peak of the total PDN impedance. Design space to damp the anti-resonance peak was examined. In particular, the values of on-board capacitance and resistance of snubber circuit has been examined by using circuit analysis tool and field solver.
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U2 - 10.1109/EDAPS.2012.6469429
DO - 10.1109/EDAPS.2012.6469429
M3 - Conference contribution
AN - SCOPUS:84875519460
SN - 9781467314435
T3 - 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012
SP - 127
EP - 130
BT - 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012
T2 - 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012
Y2 - 9 December 2012 through 11 December 2012
ER -