Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo; Hiroki Otsuka; Ryota Kobayashi; Wataru Ichimura; Sho Kiyoshige; Masahiro Terasaki; Toshio Sudo

doi:10.1109/EDAPS.2013.6724431

Anti-resonance peak shift due to variation of effective package inductance

Genki Kubo, Hiroki Otsuka, Ryota Kobayashi, Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

Original language	English
Title of host publication	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages	229-232
Number of pages	4
DOIs	https://doi.org/10.1109/EDAPS.2013.6724431
Publication status	Published - 2013 Dec 1
Event	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan Duration: 2013 Dec 12 → 2013 Dec 15

Publication series

Name	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

Conference

Conference	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Country/Territory	Japan
City	Nara
Period	13/12/12 → 13/12/15

Keywords

anti resonance peak
power integrity

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2013.6724431

Cite this

Kubo, G., Otsuka, H., Kobayashi, R., Ichimura, W., Kiyoshige, S., Terasaki, M., & Sudo, T. (2013). Anti-resonance peak shift due to variation of effective package inductance. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 229-232). Article 6724431 (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). https://doi.org/10.1109/EDAPS.2013.6724431

Anti-resonance peak shift due to variation of effective package inductance. / Kubo, Genki; Otsuka, Hiroki; Kobayashi, Ryota et al.
EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 229-232 6724431 (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kubo, G, Otsuka, H, Kobayashi, R, Ichimura, W, Kiyoshige, S, Terasaki, M & Sudo, T 2013, Anti-resonance peak shift due to variation of effective package inductance. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724431, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium, pp. 229-232, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, Japan, 13/12/12. https://doi.org/10.1109/EDAPS.2013.6724431

Kubo G, Otsuka H, Kobayashi R, Ichimura W, Kiyoshige S, Terasaki M et al. Anti-resonance peak shift due to variation of effective package inductance. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 229-232. 6724431. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). doi: 10.1109/EDAPS.2013.6724431

@inproceedings{7d0fa8f4317145429e8a32adf7e33d39,

title = "Anti-resonance peak shift due to variation of effective package inductance",

abstract = "Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.",

keywords = "anti resonance peak, power integrity",

author = "Genki Kubo and Hiroki Otsuka and Ryota Kobayashi and Wataru Ichimura and Sho Kiyoshige and Masahiro Terasaki and Toshio Sudo",

year = "2013",

month = dec,

day = "1",

doi = "10.1109/EDAPS.2013.6724431",

language = "English",

isbn = "9781479923113",

series = "EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium",

pages = "229--232",

booktitle = "EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium",

note = "2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 ; Conference date: 12-12-2013 Through 15-12-2013",

}

TY - GEN

T1 - Anti-resonance peak shift due to variation of effective package inductance

AU - Kubo, Genki

AU - Otsuka, Hiroki

AU - Kobayashi, Ryota

AU - Ichimura, Wataru

AU - Kiyoshige, Sho

AU - Terasaki, Masahiro

AU - Sudo, Toshio

PY - 2013/12/1

Y1 - 2013/12/1

N2 - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

AB - Power integrity is a serious issue in the in the modern CMOS digital systems, because power supply noise excited in core circuits induces logic instability and electromagnetic radiation. Therefore, chip-package co-design is becoming important by taking into consideration the total impedance of power distribution network (PDN) seen from the chip. Especially, parallel resonance peaks in the PDN due to the chip-package interaction induces the unwanted power supply fluctuation, and results in the degradation of signal integrity and electromagnetic interference (EMI). In this paper, peak frequency shift in the total PDN impedance in three test chips with different on-die PDN properties was observed when the package inductance was changed.

KW - anti resonance peak

KW - power integrity

UR - http://www.scopus.com/inward/record.url?scp=84894128395&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84894128395&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2013.6724431

DO - 10.1109/EDAPS.2013.6724431

M3 - Conference contribution

AN - SCOPUS:84894128395

SN - 9781479923113

T3 - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

SP - 229

EP - 232

BT - EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

T2 - 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013

Y2 - 12 December 2013 through 15 December 2013

ER -

Anti-resonance peak shift due to variation of effective package inductance

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this