Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma; Misaki Owada; Takumi Abe; Tsutomu Nakada; Makoto Kubota; Kazuyoshi Ueno

doi:10.1109/EDTM.2017.8000256

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Naoki Azuma, Misaki Owada, Takumi Abe, Tsutomu Nakada, Makoto Kubota, Kazuyoshi Ueno

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

Original language	English
Title of host publication	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	270-272
Number of pages	3
Volume	2017-June
ISBN (Electronic)	9781509046591
DOIs	https://doi.org/10.1109/EDTM.2017.8000256
Publication status	Published - 2017 Jun 13
Event	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Toyama, Japan Duration: 2017 Feb 28 → 2017 Mar 2

Other

Other	2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017
Country/Territory	Japan
City	Toyama
Period	17/2/28 → 17/3/2

Keywords

Bump
Cu pillar
EM
Reliability
Solder

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/EDTM.2017.8000256

Cite this

Azuma, N., Owada, M., Abe, T., Nakada, T., Kubota, M., & Ueno, K. (2017). Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. In 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings (Vol. 2017-June, pp. 270-272). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2017.8000256

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. / Azuma, Naoki; Owada, Misaki; Abe, Takumi et al.
2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. Vol. 2017-June Institute of Electrical and Electronics Engineers Inc., 2017. p. 270-272.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Azuma, N, Owada, M, Abe, T, Nakada, T, Kubota, M & Ueno, K 2017, Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables. in 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings. vol. 2017-June, Institute of Electrical and Electronics Engineers Inc., pp. 270-272, 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017, Toyama, Japan, 17/2/28. https://doi.org/10.1109/EDTM.2017.8000256

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title = "Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables",

abstract = "To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.",

keywords = "Bump, Cu pillar, EM, Reliability, Solder",

author = "Naoki Azuma and Misaki Owada and Takumi Abe and Tsutomu Nakada and Makoto Kubota and Kazuyoshi Ueno",

year = "2017",

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doi = "10.1109/EDTM.2017.8000256",

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volume = "2017-June",

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booktitle = "2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings",

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AU - Azuma, Naoki

AU - Owada, Misaki

AU - Abe, Takumi

AU - Nakada, Tsutomu

AU - Kubota, Makoto

AU - Ueno, Kazuyoshi

PY - 2017/6/13

Y1 - 2017/6/13

N2 - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

AB - To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and lowcost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.

KW - Bump

KW - Cu pillar

KW - EM

KW - Reliability

KW - Solder

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EP - 272

BT - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2017 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2017

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ER -

Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

Abstract

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Keywords

ASJC Scopus subject areas

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