TY - GEN
T1 - Characterization of net configurations for multichip modules
AU - Okada, Takashi
AU - Sudo, Toshio
PY - 1994/1/1
Y1 - 1994/1/1
N2 - An investigation of the design considerations for MCMs based on CMOS VLSI has been carried out with the aim of achieving a higher performance system. Included in the investigation were output driver and receiver characteristics and net configurations in MCM. Four MCM types have been introduced: MCM-D, MCM-Si, MCM-C, and MCM-L. Time domain analysis using the SPICE simulation program was carried out taking into consideration a lossy transmission line model. A simpler criterion for the critical damping condition and an estimation method for the signal delay of the network with a lumped circuit approximation is proposed to determine a preferable interconnect network including the output driver and the loads. The effect of the net configuration was also analyzed and the preferences among the net configurations have been represented with only two net parameters such as the total net length and the far-end length.
AB - An investigation of the design considerations for MCMs based on CMOS VLSI has been carried out with the aim of achieving a higher performance system. Included in the investigation were output driver and receiver characteristics and net configurations in MCM. Four MCM types have been introduced: MCM-D, MCM-Si, MCM-C, and MCM-L. Time domain analysis using the SPICE simulation program was carried out taking into consideration a lossy transmission line model. A simpler criterion for the critical damping condition and an estimation method for the signal delay of the network with a lumped circuit approximation is proposed to determine a preferable interconnect network including the output driver and the loads. The effect of the net configuration was also analyzed and the preferences among the net configurations have been represented with only two net parameters such as the total net length and the far-end length.
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M3 - Conference contribution
AN - SCOPUS:0028312785
SN - 0818655623
T3 - Proceedings of the 1994 IEEE Multi-Chip Module Conference
SP - 32
EP - 37
BT - Proceedings of the 1994 IEEE Multi-Chip Module Conference
A2 - Anon, null
PB - Publ by IEEE
T2 - Proceedings of the IEEE Multi-Chip Module Conference
Y2 - 15 March 1994 through 17 March 1994
ER -