| Original language | English |
|---|---|
| Journal | Asia-pacific EMC Symposium 2011 |
| Publication status | Published - 2011 May 18 |
Chip-Package-Board Modeling for LCD Driver IC
Koji Sakuma, Toshio Sudo
Research output: Contribution to journal › Article › peer-review
Koji Sakuma, Toshio Sudo
Research output: Contribution to journal › Article › peer-review
| Original language | English |
|---|---|
| Journal | Asia-pacific EMC Symposium 2011 |
| Publication status | Published - 2011 May 18 |