| Original language | English |
|---|---|
| Journal | Proceedings of Annual Dielectric and CVD Metallization Symposium |
| Publication status | Published - 1995 Nov 1 |
Copper and tungsten metallization using MOCVD-TiN barrier layer (Invited)
K.Ueno K.Ueno, Kazuyoshi Ueno
Research output: Contribution to journal › Article › peer-review