Correlation of PDN impedance between measurements and simulation of 3D-SiP

Shohei Kawaguchi; Masaomi Sato; Hiroki Takatani; Yosuke Tanaka; Haruya Fujita; Yoichi Suto; Toshio Sudo

doi:10.1109/EDAPS.2013.6724413

Correlation of PDN impedance between measurements and simulation of 3D-SiP

Shohei Kawaguchi, Masaomi Sato, Hiroki Takatani, Yosuke Tanaka, Haruya Fujita, Yoichi Suto, Toshio Sudo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Recently, ultra-wide bus 3D-SiP with TSV's has attracted great attention to achieve energy-saving and high-performance system level module. TSV technology is a new technology of vertical wiring to make shorter than the conventional wire bonding. However, the power supply integrity and signal integrity has become an issue due to the increase of simultaneous switching output buffers. In this paper, PDN impedances of 3D-SiP were examined by the measurement and simulation. Simulated PDN impedances of three chips were well correlated with the measured results.

Original language	English
Title of host publication	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium
Pages	158-161
Number of pages	4
DOIs	https://doi.org/10.1109/EDAPS.2013.6724413
Publication status	Published - 2013 Dec 1
Event	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013 - Nara, Japan Duration: 2013 Dec 12 → 2013 Dec 15

Publication series

Name	EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium

Conference

Conference	2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013
Country/Territory	Japan
City	Nara
Period	13/12/12 → 13/12/15

Keywords

3D-SiP
measurement
on-die capacitance
power distribution network (PDN)
simultaneous switching noise
ultra-wide bus

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2013.6724413

Cite this

Kawaguchi, S., Sato, M., Takatani, H., Tanaka, Y., Fujita, H., Suto, Y., & Sudo, T. (2013). Correlation of PDN impedance between measurements and simulation of 3D-SiP. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (pp. 158-161). [6724413] (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). https://doi.org/10.1109/EDAPS.2013.6724413

Correlation of PDN impedance between measurements and simulation of 3D-SiP. / Kawaguchi, Shohei; Sato, Masaomi; Takatani, Hiroki et al.

EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 158-161 6724413 (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kawaguchi, S, Sato, M, Takatani, H, Tanaka, Y, Fujita, H, Suto, Y & Sudo, T 2013, Correlation of PDN impedance between measurements and simulation of 3D-SiP. in EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium., 6724413, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium, pp. 158-161, 2013 6th IEEE Electrical Design of Advanced Packaging Systems Symposium, EDAPS 2013, Nara, Japan, 13/12/12. https://doi.org/10.1109/EDAPS.2013.6724413

Kawaguchi S, Sato M, Takatani H, Tanaka Y, Fujita H, Suto Y et al. Correlation of PDN impedance between measurements and simulation of 3D-SiP. In EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. 2013. p. 158-161. 6724413. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium). doi: 10.1109/EDAPS.2013.6724413

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abstract = "Recently, ultra-wide bus 3D-SiP with TSV's has attracted great attention to achieve energy-saving and high-performance system level module. TSV technology is a new technology of vertical wiring to make shorter than the conventional wire bonding. However, the power supply integrity and signal integrity has become an issue due to the increase of simultaneous switching output buffers. In this paper, PDN impedances of 3D-SiP were examined by the measurement and simulation. Simulated PDN impedances of three chips were well correlated with the measured results.",

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Correlation of PDN impedance between measurements and simulation of 3D-SiP

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Keywords

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