Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	108-112
Number of pages	5
Journal	Yosetsu Gakkai Shi/Journal of the Japan Welding Society
Volume	69
Issue number	2
DOIs	https://doi.org/10.2207/qjjws1943.69.108
Publication status	Published - 2000
Externally published	Yes

ASJC Scopus subject areas

@article{71b4fed4b89840bd9c7d3da86556c9ff,

title = "Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly",

author = "Yoshiharu Kariya and Masahisa Otsuka",

year = "2000",

doi = "10.2207/qjjws1943.69.108",

language = "English",

volume = "69",

pages = "108--112",

journal = "Yosetsu Gakkai Shi/Journal of the Japan Welding Society",

issn = "0021-4787",

publisher = "Japan Welding Society",

number = "2",

}

TY - JOUR

T1 - Current Soldering Technology and Reliability Issue in Lead-Free Solder for Electronic Assembly

AU - Kariya, Yoshiharu

AU - Otsuka, Masahisa

PY - 2000

Y1 - 2000

UR - http://www.scopus.com/inward/record.url?scp=0038639504&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038639504&partnerID=8YFLogxK

U2 - 10.2207/qjjws1943.69.108

DO - 10.2207/qjjws1943.69.108

M3 - Article

AN - SCOPUS:0038639504

SN - 0021-4787

VL - 69

SP - 108

EP - 112

JO - Yosetsu Gakkai Shi/Journal of the Japan Welding Society

JF - Yosetsu Gakkai Shi/Journal of the Japan Welding Society

IS - 2

ER -