Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA

Moe Nozaki; Yoshiharu Kariya; Yoshiyuki Hiroshima; Nobuo Taketomi; Kenichi Ohashi; Kenichi Tomioka; Shunichi Kikuchi; Jack Tan

doi:10.1109/LTB-3D53950.2021.9598404

Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA

Moe Nozaki, Yoshiharu Kariya, Yoshiyuki Hiroshima, Nobuo Taketomi, Kenichi Ohashi, Kenichi Tomioka, Shunichi Kikuchi, Jack Tan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The effects of structural factors on the delamination of the stacked via in high-density multilayer printed wiring boards were investigated by a statistical approach. Although reducing the height of via or the number of via stacks is effective to prevent the delamination, if these cannot be reduced, the risk of the delamination is eased by increasing the pitch of the stacked via.

Original language	English
Title of host publication	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	42
Number of pages	1
ISBN (Electronic)	9781665405676
DOIs	https://doi.org/10.1109/LTB-3D53950.2021.9598404
Publication status	Published - 2021 Oct 5
Event	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 - Virtual, Online, Japan Duration: 2021 Oct 5 → 2021 Oct 11

Publication series

Name	2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021

Conference

Conference	7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021
Country/Territory	Japan
City	Virtual, Online
Period	21/10/5 → 21/10/11

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/LTB-3D53950.2021.9598404

Cite this

Nozaki, M., Kariya, Y., Hiroshima, Y., Taketomi, N., Ohashi, K., Tomioka, K., Kikuchi, S., & Tan, J. (2021). Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021 (pp. 42). (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/LTB-3D53950.2021.9598404

Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA. / Nozaki, Moe; Kariya, Yoshiharu; Hiroshima, Yoshiyuki et al.
2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 42 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nozaki, M, Kariya, Y, Hiroshima, Y, Taketomi, N, Ohashi, K, Tomioka, K, Kikuchi, S & Tan, J 2021, Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA. in 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Institute of Electrical and Electronics Engineers Inc., pp. 42, 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021, Virtual, Online, Japan, 21/10/5. https://doi.org/10.1109/LTB-3D53950.2021.9598404

Nozaki M, Kariya Y, Hiroshima Y, Taketomi N, Ohashi K, Tomioka K et al. Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA. In 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 42. (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021). doi: 10.1109/LTB-3D53950.2021.9598404

Nozaki, Moe ; Kariya, Yoshiharu ; Hiroshima, Yoshiyuki et al. / Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA. 2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 42 (2021 7th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2021).

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abstract = "The effects of structural factors on the delamination of the stacked via in high-density multilayer printed wiring boards were investigated by a statistical approach. Although reducing the height of via or the number of via stacks is effective to prevent the delamination, if these cannot be reduced, the risk of the delamination is eased by increasing the pitch of the stacked via.",

author = "Moe Nozaki and Yoshiharu Kariya and Yoshiyuki Hiroshima and Nobuo Taketomi and Kenichi Ohashi and Kenichi Tomioka and Shunichi Kikuchi and Jack Tan",

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Delamination analysis of stacked via in high-density multilayer printed wiring boards by FEA

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