Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Kiyokazu Yasuda, Tadashi Takemoto, Yoshiharu Kariya

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	99-102
Journal	Smart Processing Technology, High Temperature Society of Japan
Publication status	Published - 2008 Mar 1

Cite this

@article{5dcd1c92c2f74a5ba9a32c5690dfb11a,

title = "Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen",

author = "Ikuo Shohji and Tsutomu Osawa and Takashige Matsuki and Kiyokazu Yasuda and Tadashi Takemoto and Yoshiharu Kariya",

year = "2008",

month = mar,

day = "1",

language = "English",

pages = "99--102",

journal = "Smart Processing Technology, High Temperature Society of Japan",

}

TY - JOUR

T1 - Effect of Aging on Tensile Properties of Low-Melting Lead-Free Solders Evaluated by Micro Size Specimen

AU - Shohji, Ikuo

AU - Osawa, Tsutomu

AU - Matsuki, Takashige

AU - Yasuda, Kiyokazu

AU - Takemoto, Tadashi

AU - Kariya, Yoshiharu

PY - 2008/3/1

Y1 - 2008/3/1

M3 - Article

SP - 99

EP - 102

JO - Smart Processing Technology, High Temperature Society of Japan

JF - Smart Processing Technology, High Temperature Society of Japan

ER -