Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi; Yoshiharu Kariya; Tsutomu Sasaki; Masamoto Tanaka; Kohei Tatsumi

doi:10.1109/ECTC.2007.373870

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

Takayuki Kobayashi, Yoshiharu Kariya, Tsutomu Sasaki, Masamoto Tanaka, Kohei Tatsumi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

Original language	English
Title of host publication	Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages	684-688
Number of pages	5
DOIs	https://doi.org/10.1109/ECTC.2007.373870
Publication status	Published - 2007
Event	57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States Duration: 2007 May 29 → 2007 Jun 1

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	57th Electronic Components and Technology Conference 2007, ECTC '07
Country/Territory	United States
City	Sparks, NV
Period	07/5/29 → 07/6/1

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2007.373870

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Kobayashi, T., Kariya, Y., Sasaki, T., Tanaka, M., & Tatsumi, K. (2007). Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. In Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07 (pp. 684-688). Article 4249956 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2007.373870

Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. / Kobayashi, Takayuki; Kariya, Yoshiharu; Sasaki, Tsutomu et al.
Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. 2007. p. 684-688 4249956 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kobayashi, T, Kariya, Y, Sasaki, T, Tanaka, M & Tatsumi, K 2007, Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints. in Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07., 4249956, Proceedings - Electronic Components and Technology Conference, pp. 684-688, 57th Electronic Components and Technology Conference 2007, ECTC '07, Sparks, NV, United States, 07/5/29. https://doi.org/10.1109/ECTC.2007.373870

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abstract = "Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.",

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AB - Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298K and 398K. At each temperature, Sn-1.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed higher bending performance was discussed based on a mechanical fatigue test using a micro bulk specimen. Ni addition caused a fine subgrain of β-Sn, hence the crack propagation mechanism is changed, resulting in the improved fatigue performance of LF35.

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Effect of Ni addition on bending properties of Sn-Ag-Cu lead-free solder joints

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