Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

Yoshiharu Kariya, Takuya Hosoi, Shinichi Terashima, Masamoto Tanaka, Masahsia Otsuka

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	321-328
Journal	Journal of Electronic Materials
Volume	33
Publication status	Published - 2004 Apr 1

Cite this

@article{529ad9729ba44abfab733e18c5fd53d7,

title = "Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects",

author = "Yoshiharu Kariya and Takuya Hosoi and Shinichi Terashima and Masamoto Tanaka and Masahsia Otsuka",

year = "2004",

month = apr,

day = "1",

language = "English",

volume = "33",

pages = "321--328",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

}

TY - JOUR

T1 - Effect of silver content on the shear fatigue properties of Sn-Ag-Cu Flip Chip Interconnects

AU - Kariya, Yoshiharu

AU - Hosoi, Takuya

AU - Terashima, Shinichi

AU - Tanaka, Masamoto

AU - Otsuka, Masahsia

PY - 2004/4/1

Y1 - 2004/4/1

M3 - Article

SN - 0361-5235

VL - 33

SP - 321

EP - 328

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

ER -