Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free solders

Ikuo Shohji, Tsutomu Osawa, Takashige Matsuki, Yoshiharu Kariya, Kiyokazu Yasuda, Tadashi Takemoto

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)


Tensile properties of several Sn-Ag-Cu lead-free solders have been investigated by micro size specimens. For as-cast specimens, tensile strength increases with increasing content of Cu and Ag. After aging at 120°C for 168 h, however, tensile strengths are similar among eutectic and hypereutectic alloys. The similar tendency was observed among hypoeutectic alloys. Moreover, negligible change was found in tensile strength between specimens aged at 120°C for 168 h and 504 h in all solders. The strength change with aging corresponds to microstructural change of the solder. In the cases of eutectic and hypoeutectic alloys, as-cast microstructures are composed of coarsened primary Sn phases and finer eutectic phases of Sn and intermetallic compounds. The primary Sn phases and the eutectic phases are homogenized upon aging. In contrast, finer Sn and eutectic phases are formed in as-cast hypereutectic alloys. The finer phases are coarsened upon aging. After aging, homogenization of the Sn phases and the eutectic phases occurred in all solders.

Original languageEnglish
Pages (from-to)1175-1179
Number of pages5
JournalMaterials Transactions
Issue number5
Publication statusPublished - 2008 May 1


  • Aging
  • Lead-free solder
  • Micro size specimen
  • Microstructure
  • Miniature testing
  • Tensile properties
  • Tin-silver-copper

ASJC Scopus subject areas

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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