Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Takuma Sato; Yoshiharu Kariya; Kazuma Fukui

doi:10.1115/IPACK2013-73193

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

Takuma Sato, Yoshiharu Kariya, Kazuma Fukui

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.

Original language	English
Title of host publication	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs	https://doi.org/10.1115/IPACK2013-73193
Publication status	Published - 2013 Dec 1
Event	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States Duration: 2013 Jul 16 → 2013 Jul 18

Publication series

Name	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume	1

Conference

Conference	ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/Territory	United States
City	Burlingame, CA
Period	13/7/16 → 13/7/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Computer Networks and Communications
Computer Science Applications
Hardware and Architecture
Information Systems
Electronic, Optical and Magnetic Materials

Access to Document

10.1115/IPACK2013-73193

Cite this

Sato, T., Kariya, Y., & Fukui, K. (2013). Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; Vol. 1). https://doi.org/10.1115/IPACK2013-73193

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. / Sato, Takuma; Kariya, Yoshiharu; Fukui, Kazuma.
ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; Vol. 1).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Sato, T, Kariya, Y & Fukui, K 2013, Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. in ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, vol. 1, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, Burlingame, CA, United States, 13/7/16. https://doi.org/10.1115/IPACK2013-73193

Sato T, Kariya Y, Fukui K. Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013). doi: 10.1115/IPACK2013-73193

Sato, Takuma ; Kariya, Yoshiharu ; Fukui, Kazuma. / Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy. ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013. 2013. (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013).

@inproceedings{cbe46cc3972d42b39286e25decdc7718,

title = "Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy",

abstract = "In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.",

author = "Takuma Sato and Yoshiharu Kariya and Kazuma Fukui",

year = "2013",

month = dec,

day = "1",

doi = "10.1115/IPACK2013-73193",

language = "English",

isbn = "9780791855751",

series = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013",

booktitle = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013",

note = "ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 ; Conference date: 16-07-2013 Through 18-07-2013",

}

TY - GEN

T1 - Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

AU - Sato, Takuma

AU - Kariya, Yoshiharu

AU - Fukui, Kazuma

PY - 2013/12/1

Y1 - 2013/12/1

N2 - In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.

AB - In this study, the effects of temperature and strain rate on low cycle fatigue life of Bi-Sn eutectic alloys have been studied. The fatigue life improves with the increasing of temperature and the decreasing of strain rate. This is a reverse phenomenon from characteristics found in general metals. As temperature increases and strain rate decreases, grin boundary sliding becomes the dominant deformation mechanism and the fatigue ductility coefficient increases, resulting in an improvement of fatigue life. To the extent of this study, dependence on temperature and strain rate can be expressed by Manson-Coffin's law modified using Z-parameters.

UR - http://www.scopus.com/inward/record.url?scp=84894659597&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84894659597&partnerID=8YFLogxK

U2 - 10.1115/IPACK2013-73193

DO - 10.1115/IPACK2013-73193

M3 - Conference contribution

AN - SCOPUS:84894659597

SN - 9780791855751

T3 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013

BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013

T2 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013

Y2 - 16 July 2013 through 18 July 2013

ER -

Effect of temperature and strain rate on low-cycle fatigue life of Bi-Sn eutectic alloy

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