| Original language | English |
|---|---|
| Journal | Default journal |
| Publication status | Published - 1999 Mar 1 |
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka
Research output: Contribution to journal › Article › peer-review
59
Citations
(Scopus)