Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package

Y. K, a a, K. Zama, Y. Kariya, T. Mikami, T. Kobayashi, T. Enomoto, K. Hirata

Research output: Contribution to journal › Article › peer-review

Cite this

@article{60234c9e3f45467597b1cd3852e03e07,

title = "Effect of Visco-elasticity on Reliability Analysis of Flip-Chip Package",

author = "Y. K and a a and K. Zama and Y. Kariya and T. Mikami and T. Kobayashi and T. Enomoto and K. Hirata",

year = "2009",

month = jul,

day = "1",

language = "English",

pages = "755--759",

journal = "ASME-InterPACK",

}