Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits

Suehiro Sugitani; Kiyomitsu Onodera; Shinji Aoyama; Makoto Hirano; Masami Tokumitsu

doi:10.1116/1.1479362

Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits

Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Masami Tokumitsu

Research output: Contribution to journal › Conference article › peer-review

3 Citations (Scopus)

Abstract

The fabrication of ultracompact three dimensional monolithic microwave circuits (MMIC) having a sophisticated three-dimensional (3D) interconnection structure was discussed. The circuits were manufactured using the inductively coupled plasma etching with a double-layer mask, consisting of WSi covered with photoresists containing silicon. The developed method enabled the formation of holes to any levels of interconnections simultaneously. It resulted in smaller chip area, higher performance and greater design flexibility in MMICs.

Original language	English
Pages (from-to)	1019-1025
Number of pages	7
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	20
Issue number	3
DOIs	https://doi.org/10.1116/1.1479362
Publication status	Published - 2002 May 1
Event	20th North American Conference on Molecular Beam Epitaxy - Providence, RI, United States Duration: 2001 Oct 1 → 2001 Oct 3

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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10.1116/1.1479362

Cite this

Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits. / Sugitani, Suehiro; Onodera, Kiyomitsu; Aoyama, Shinji et al.

In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 20, No. 3, 01.05.2002, p. 1019-1025.

Research output: Contribution to journal › Conference article › peer-review

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AU - Tokumitsu, Masami

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Etching method for fabricating ultracompact three-dimensional monolithic microwave integrated circuits

Abstract

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