Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Physics & Astronomy

• activation energy 17%
• balls 10%
• constitutive equations 12%
• creep properties 100%
• evaluation 45%
• exponents 18%
• intermetallics 10%
• microstructure 14%
• solders 80%
• stress relaxation 78%
• temperature 21%

Engineering & Materials Science

• Activation energy 25%
• Constitutive equations 13%
• Creep 62%
• Intermetallics 12%
• Microstructure 16%
• Soldering alloys 70%
• Stress relaxation 86%
• Temperature 28%

Chemical Compounds

• Creep 88%
• Microstructure 19%
• Reaction Activation Energy 20%
• Solder 89%
• Stress Relaxation 96%