TY - GEN
T1 - Experiment and simulation of power supply switching current dependency on on-chip capacitance
AU - Hoshino, Kozo
AU - Satomi, Ryuki
AU - Sudo, Toshio
AU - Okano, Hirokazu
AU - Ishikawa, Miyuki
AU - Shibayama, Hiroyuki
AU - Aoyagi, Hiroshi
AU - Kushibe, Hidefumi
AU - Yamagishi, Kunihiko
PY - 2009
Y1 - 2009
N2 - Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.
AB - Power distribution network (PDN) of LSI has become one of important design parameters to reduce simultaneous switching noise for core circuits as well as I/O circuits. Power distribution network of LSI generally consists of meshed power and ground conductors and on-chip decoupling capacitors. For mobile communication and automotive applications, switching current of high-performance CMOS LSIs must be controlled to be low as possible in order to suppress associated electromagnetic interference (EMI). Therefore, on-chip decoupling capacitors must be properly arranged on a chip to optimize the amount of capacitor and to minimize the occupied area by on-chip capacitor. In this paper, a CMOS test chip has been developed which has several test element groups (TEGs) inside. MOS capacitor cells were distributed in each TEG in a different density. Then, an evaluation board was designed to measure the power supply switching current for the each TEG. Furthermore, the power supply switching current was simulated by using a commercial available EDA tool. Reduction level of the switching current was measured and simulated as a function of the value of on-chip decoupling capacitor. Based on both experimental and simulation results, it has been probed that proper density of decoupling capacitor on a chip has been well estimated.
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U2 - 10.1109/EDAPS.2009.5403989
DO - 10.1109/EDAPS.2009.5403989
M3 - Conference contribution
AN - SCOPUS:77950202665
SN - 9781424453504
T3 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
BT - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
T2 - 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
Y2 - 2 December 2009 through 4 December 2009
ER -