Experiment on evaporation heat transfer performance of porous surface

Shigeki Hirasawa; Takuya Nakajima; Tetsuya Urimoto; Yuya Tsujimoto; Yusuke Takeuchi; Tsuyoshi Kawanami; Katsuaki Shirai

doi:10.1109/ITHERM.2016.7517520

Experiment on evaporation heat transfer performance of porous surface

Shigeki Hirasawa, Takuya Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Yusuke Takeuchi, Tsuyoshi Kawanami, Katsuaki Shirai

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

Original language	English
Title of host publication	Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-5
Number of pages	5
ISBN (Electronic)	9781467381215
DOIs	https://doi.org/10.1109/ITHERM.2016.7517520
Publication status	Published - 2016 Jul 20
Externally published	Yes
Event	15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States Duration: 2016 May 31 → 2016 Jun 3

Publication series

Name	Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

Other

Other	15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
Country/Territory	United States
City	Las Vegas
Period	16/5/31 → 16/6/3

Keywords

Cooling electronic devices
cross-grooved surface
dry portion
evaporation
heat transfer coefficient
pool boiling
porous surface
thin glass-beads layer

ASJC Scopus subject areas

Fluid Flow and Transfer Processes
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Hardware and Architecture
Mechanics of Materials

Access to Document

10.1109/ITHERM.2016.7517520

Cite this

Hirasawa, S., Nakajima, T., Urimoto, T., Tsujimoto, Y., Takeuchi, Y., Kawanami, T., & Shirai, K. (2016). Experiment on evaporation heat transfer performance of porous surface. In Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 (pp. 1-5). [7517520] (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ITHERM.2016.7517520

Experiment on evaporation heat transfer performance of porous surface. / Hirasawa, Shigeki; Nakajima, Takuya; Urimoto, Tetsuya et al.
Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1-5 7517520 (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hirasawa, S, Nakajima, T, Urimoto, T, Tsujimoto, Y, Takeuchi, Y, Kawanami, T & Shirai, K 2016, Experiment on evaporation heat transfer performance of porous surface. in Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016., 7517520, Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016, Institute of Electrical and Electronics Engineers Inc., pp. 1-5, 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016, Las Vegas, United States, 16/5/31. https://doi.org/10.1109/ITHERM.2016.7517520

Hirasawa S, Nakajima T, Urimoto T, Tsujimoto Y, Takeuchi Y, Kawanami T et al. Experiment on evaporation heat transfer performance of porous surface. In Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1-5. 7517520. (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016). doi: 10.1109/ITHERM.2016.7517520

Hirasawa, Shigeki ; Nakajima, Takuya ; Urimoto, Tetsuya et al. / Experiment on evaporation heat transfer performance of porous surface. Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 1-5 (Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016).

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keywords = "Cooling electronic devices, cross-grooved surface, dry portion, evaporation, heat transfer coefficient, pool boiling, porous surface, thin glass-beads layer",

author = "Shigeki Hirasawa and Takuya Nakajima and Tetsuya Urimoto and Yuya Tsujimoto and Yusuke Takeuchi and Tsuyoshi Kawanami and Katsuaki Shirai",

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doi = "10.1109/ITHERM.2016.7517520",

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publisher = "Institute of Electrical and Electronics Engineers Inc.",

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AU - Urimoto, Tetsuya

AU - Tsujimoto, Yuya

AU - Takeuchi, Yusuke

AU - Kawanami, Tsuyoshi

AU - Shirai, Katsuaki

PY - 2016/7/20

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N2 - Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

AB - Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

KW - Cooling electronic devices

KW - cross-grooved surface

KW - dry portion

KW - evaporation

KW - heat transfer coefficient

KW - pool boiling

KW - porous surface

KW - thin glass-beads layer

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Experiment on evaporation heat transfer performance of porous surface

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