Abstract
CMOS-based multichip modules have been actively developed for achieving high performance and high speed systems. Simultaneous switching noise (SSN) induced by CMOS output buffers is a serious issue in multichip modules as well as single-chip packages to ensure stable operation and to derive inherent speed performance. Multichip modules are expected to have smaller switching noise level than the case of single-chip packages by removing a first-level package and its parasitics. This paper reports the measurement results of switching noises for different types of MCMs using a switching noise generating chip. Two types of test vehicles were fabricated and measurement results were compared. Noise distribution on a ground plane was also measured.
| Original language | English |
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| Pages | 217-220 |
| Number of pages | 4 |
| Publication status | Published - 1995 Jan 1 |
| Event | Proceedings of the 1995 IEEE Multi-Chip Module Conference - Santa Cruz, CA, USA Duration: 1995 Jan 31 → 1995 Feb 2 |
Other
| Other | Proceedings of the 1995 IEEE Multi-Chip Module Conference |
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| City | Santa Cruz, CA, USA |
| Period | 95/1/31 → 95/2/2 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering