Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening

Kouichi Moroka, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Fatigue Life Prediction of BGA Solder Joint with Consideration of Microstructural Coarsening'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds