TY - GEN
T1 - Flexible Electrostatic Adhesive Device and its Performance Evaluations
AU - Takahashi, Kotaro
AU - Hasegawa, Tadahiro
AU - Yuta, Shinrichi
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4/25
Y1 - 2019/4/25
N2 - A flexible electrostatic adhesive device was modified successfully to improve an aging characteristics. The experimental results using a previous electrostatic adhesive device has shown that, in concrete wall, the maximum adhesive force was 1kgf or more during applied voltage 10kV. However, problems that the adhesive force decreases depending on aging arose. To solve the problem, the design of the electrostatic device was modified. Thereby, the electrostatic adhesive device succeeded that an adhesive force was generated 1kgf or more during a month or more. The flexible electrostatic adhesive device is useful for a practical use to stick to an inspection apparatus on a concrete wall of a bridge or a tunnel.
AB - A flexible electrostatic adhesive device was modified successfully to improve an aging characteristics. The experimental results using a previous electrostatic adhesive device has shown that, in concrete wall, the maximum adhesive force was 1kgf or more during applied voltage 10kV. However, problems that the adhesive force decreases depending on aging arose. To solve the problem, the design of the electrostatic device was modified. Thereby, the electrostatic adhesive device succeeded that an adhesive force was generated 1kgf or more during a month or more. The flexible electrostatic adhesive device is useful for a practical use to stick to an inspection apparatus on a concrete wall of a bridge or a tunnel.
UR - http://www.scopus.com/inward/record.url?scp=85065647967&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85065647967&partnerID=8YFLogxK
U2 - 10.1109/SII.2019.8700457
DO - 10.1109/SII.2019.8700457
M3 - Conference contribution
AN - SCOPUS:85065647967
T3 - Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
SP - 679
EP - 682
BT - Proceedings of the 2019 IEEE/SICE International Symposium on System Integration, SII 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2019 IEEE/SICE International Symposium on System Integration, SII 2019
Y2 - 14 January 2019 through 16 January 2019
ER -