Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano; K.Doi K.Doi; E.Hosomi E.Hosomi; H.Tazawa H.Tazawa; K.Shibazaki K.Shibazaki; C.Takubo C.Takubo; T.Okada T.Okada; Y.Hiruta Y.Hiruta; T.Sudo T.Sudo; Toshio Sudo

Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano, K.Doi K.Doi, E.Hosomi E.Hosomi, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, C.Takubo C.Takubo, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Functional Control Systems

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	15-17
Journal	VLSI and Microsystem Packaging Workshop, Baveno Italy,
Publication status	Published - 1996 Oct 15

Cite this

@article{e2106d61baa24971ba81b74ab42fa577,

title = "Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,",

author = "N.Hirano N.Hirano and K.Doi K.Doi and E.Hosomi E.Hosomi and H.Tazawa H.Tazawa and K.Shibazaki K.Shibazaki and C.Takubo C.Takubo and T.Okada T.Okada and Y.Hiruta Y.Hiruta and T.Sudo T.Sudo and Toshio Sudo",

year = "1996",

month = oct,

day = "15",

language = "English",

pages = "15--17",

journal = "VLSI and Microsystem Packaging Workshop, Baveno Italy,",

}

TY - JOUR

T1 - Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

AU - N.Hirano, N.Hirano

AU - K.Doi, K.Doi

AU - E.Hosomi, E.Hosomi

AU - H.Tazawa, H.Tazawa

AU - K.Shibazaki, K.Shibazaki

AU - C.Takubo, C.Takubo

AU - T.Okada, T.Okada

AU - Y.Hiruta, Y.Hiruta

AU - T.Sudo, T.Sudo

AU - Sudo, Toshio

PY - 1996/10/15

Y1 - 1996/10/15

M3 - Article

SP - 15

EP - 17

JO - VLSI and Microsystem Packaging Workshop, Baveno Italy,

JF - VLSI and Microsystem Packaging Workshop, Baveno Italy,

ER -