Flip-Chip Bonding Process for CSTP Interconnected by Eutectic Solder Bumps,

N.Hirano N.Hirano, K.Doi K.Doi, E.Hosomi E.Hosomi, H.Tazawa H.Tazawa, K.Shibazaki K.Shibazaki, C.Takubo C.Takubo, T.Okada T.Okada, Y.Hiruta Y.Hiruta, T.Sudo T.Sudo, Toshio Sudo

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)15-17
JournalVLSI and Microsystem Packaging Workshop, Baveno Italy,
Publication statusPublished - 1996 Oct 15

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