Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera; Makoto Hirano; Ichihiko Toyoda; Masami Tokumitsu; Tsuneo Tokumitsu

Folded U-shaped microwire technology for ultra-compact 3D MMICs

Kiyomitsu Onodera, Makoto Hirano, Ichihiko Toyoda, Masami Tokumitsu, Tsuneo Tokumitsu

Research output: Contribution to journal › Conference article › peer-review

Abstract

A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

Original language	English
Pages (from-to)	1153-1156
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	2
Publication status	Published - 1996 Jan 1
Event	Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) - San Franscisco, CA, USA Duration: 1996 Jun 17 → 1996 Jun 21

ASJC Scopus subject areas

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

Cite this

@article{109ad25196b84adfb010c08378e9caff,

title = "Folded U-shaped microwire technology for ultra-compact 3D MMICs",

abstract = "A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.",

author = "Kiyomitsu Onodera and Makoto Hirano and Ichihiko Toyoda and Masami Tokumitsu and Tsuneo Tokumitsu",

year = "1996",

month = jan,

day = "1",

language = "English",

volume = "2",

pages = "1153--1156",

journal = "IEEE MTT-S International Microwave Symposium Digest",

issn = "0149-645X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3) ; Conference date: 17-06-1996 Through 21-06-1996",

}

TY - JOUR

T1 - Folded U-shaped microwire technology for ultra-compact 3D MMICs

AU - Onodera, Kiyomitsu

AU - Hirano, Makoto

AU - Toyoda, Ichihiko

AU - Tokumitsu, Masami

AU - Tokumitsu, Tsuneo

PY - 1996/1/1

Y1 - 1996/1/1

N2 - A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

AB - A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultra-compact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.

UR - http://www.scopus.com/inward/record.url?scp=0029697845&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029697845&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0029697845

SN - 0149-645X

VL - 2

SP - 1153

EP - 1156

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

T2 - Proceedings of the 1996 IEEE MTT-S International Microwave Symposium Digest. Part 1 (of 3)

Y2 - 17 June 1996 through 21 June 1996

ER -

Folded U-shaped microwire technology for ultra-compact 3D MMICs

Abstract

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this