Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer

Koichi Nagase, Atsushi Fujii, Kaiwen Zhong, Yoshiharu Kariya

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint

Dive into the research topics of 'Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds