Fundamental circuit technology for three-dimensional MMICs

Ichihiko Toyoda, Makoto Hirano, Kenjiro Nishikawa, Kenji Kamogawa

    Research output: Contribution to journalArticlepeer-review


    A novel three-dimensional MMIC technology is developed to make highly integrated multifunctional MMICs. This paper describes its structure and features and various new transmission lines using the structure. Novel passive circuits, such as a quadrature hybrid, an in-phase power divider, and a balun, are demonstrated to highlight the advantages of the 3-D MMIC technology. In the last section, the design concepts of a low-noise amplifier, a variable gain amplifier, and an image-rejection mixer are also described. The highly integrated multifunctional MMICs and masterslice MMICs described in this special issue can be made using 3-D MMIC technology and these fundamental circuits.

    Original languageEnglish
    Pages (from-to)1269-1275
    Number of pages7
    JournalNTT R and D
    Issue number12
    Publication statusPublished - 1996 Dec 1

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering


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