Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	117
Journal	International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）
Publication status	Published - 1994 Dec 19

Cite this

@article{92af33763b4b45fdb182a57b4ab0dba6,

title = "Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1994",

month = dec,

day = "19",

language = "English",

pages = "117",

journal = "International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）",

}

TY - JOUR

T1 - Future Trend for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

AU - Homma, T.

PY - 1994/12/19

Y1 - 1994/12/19

M3 - Article

SP - 117

JO - International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）

JF - International Conference on Electronic Materials (ICEM) Abstracts（Symposium E2.5）

ER -