Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	234-239
Journal	Journal of Materials Chemistry and Physics
Volume	41
Publication status	Published - 1995 Apr 1

Cite this

@article{c0ae1afbe5c04262b648a3207f4f32bc,

title = "Future Trends for Interlayer Dielectric Films and Their Formation Technologies in VLSI Multilevel Interconnections",

author = "T. Homma",

year = "1995",

month = apr,

day = "1",

language = "English",

volume = "41",

pages = "234--239",

journal = "Journal of Materials Chemistry and Physics",

}