TY - GEN
T1 - Geyser-1
T2 - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
AU - Ikebuchi, D.
AU - Seki, N.
AU - Kojima, Y.
AU - Kamata, M.
AU - Zhao, L.
AU - Amano, H.
AU - Shirai, T.
AU - Koyamat, S.
AU - Hashida, T.
AU - Umahashi, Y.
AU - Masuda, H.
AU - Usami, K.
AU - Takeda, S.
AU - Nakamura, H.
AU - Namiki, M.
AU - Kondo, M.
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Geyser-1, a prototype MIPS R3000 CPU with fine grain runtime PG for major computational components in the execution stage is available. Function units such as CLU, shifter, multiplier and divider are power-gated and controlled at runtime such that only the function unit to be used is powered-on to minimize the leakage power. The evaluation results on the real chip reveals that the fine grain runtime PG mechanism works without electric problems. It reduces the leakage power 7% at 25 °C and 24% at 80°C. The evaluation results using benchmark programs show that the power consumption can be reduced from 3% at 25°C and 30% at 80° C.
AB - Geyser-1, a prototype MIPS R3000 CPU with fine grain runtime PG for major computational components in the execution stage is available. Function units such as CLU, shifter, multiplier and divider are power-gated and controlled at runtime such that only the function unit to be used is powered-on to minimize the leakage power. The evaluation results on the real chip reveals that the fine grain runtime PG mechanism works without electric problems. It reduces the leakage power 7% at 25 °C and 24% at 80°C. The evaluation results using benchmark programs show that the power consumption can be reduced from 3% at 25°C and 30% at 80° C.
UR - http://www.scopus.com/inward/record.url?scp=76249084101&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=76249084101&partnerID=8YFLogxK
U2 - 10.1109/ASSCC.2009.5357257
DO - 10.1109/ASSCC.2009.5357257
M3 - Conference contribution
AN - SCOPUS:76249084101
SN - 9781424444342
T3 - Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
SP - 281
EP - 284
BT - Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
Y2 - 16 November 2009 through 18 November 2009
ER -