| Original language | English |
|---|---|
| Pages (from-to) | 83-91 |
| Journal | J. Mechanics of Materials. |
| Volume | (1998) |
| Publication status | Published - 1800 |
Granular Modeling Approach to Electro-Packaging Materials.
T. Aizawa, T. Iwai, J. Kihara
Research output: Contribution to journal › Article › peer-review