| Original language | English |
|---|---|
| Pages (from-to) | 314-319 |
| Journal | ISHM, Seattle, |
| Publication status | Published - 1998 Oct 25 |
High-Density Multichip Module by Chip-On-Wafer Technology,
S.Kimijima S.Kimijima, T.Miyagi T.Miyagi, T.Sudo T.Sudo, O.Shimada O.Shimada, Toshio Sudo
Research output: Contribution to journal › Article › peer-review