High reliability Cu interconnection utilizing a low contamination CoWP capping layer

T. Ishigami, T. Kurokawa, Y. Kakuhara, B. Withers, J. Jacobs, A. Kolics, I. Ivanov, M. Sekine, K. Ueno

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

18 Citations (Scopus)

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Engineering & Materials Science