Highly integrated 3-D MMIC technology being applied to novel masterslice GaAs- and Si-MMIC's

Tsuneo Tokumitsu, Makoto Hirano, Kimiyoshi Yamasaki, Chikara Yamaguchi, Masayoshi Aikawa

    Research output: Contribution to conferencePaperpeer-review

    2 Citations (Scopus)

    Fingerprint

    Dive into the research topics of 'Highly integrated 3-D MMIC technology being applied to novel masterslice GaAs- and Si-MMIC's'. Together they form a unique fingerprint.

    Engineering & Materials Science