TY - GEN
T1 - Integrating laser diode and optical isolator by photosensitive adhesive bonding
AU - Yokoi, H.
AU - Ichishima, N.
AU - Myouenzono, I.
PY - 2013
Y1 - 2013
N2 - An integrating technique between a laser diode and an optical isolator is proposed. The optical isolator has a magneto-optic waveguide with a Si guiding layer. The laser diode is integrated with the optical isolator by use of photosensitive adhesive bonding. A coupling efficiency between an active layer of the laser diode and a passive waveguide is discussed. Photosensitive adhesive bonding between a garnet crystal and a SiO2 substrate is demonstrated.
AB - An integrating technique between a laser diode and an optical isolator is proposed. The optical isolator has a magneto-optic waveguide with a Si guiding layer. The laser diode is integrated with the optical isolator by use of photosensitive adhesive bonding. A coupling efficiency between an active layer of the laser diode and a passive waveguide is discussed. Photosensitive adhesive bonding between a garnet crystal and a SiO2 substrate is demonstrated.
UR - http://www.scopus.com/inward/record.url?scp=84885700371&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84885700371&partnerID=8YFLogxK
U2 - 10.1149/05007.0393ecst
DO - 10.1149/05007.0393ecst
M3 - Conference contribution
AN - SCOPUS:84885700371
SN - 9781607683551
T3 - ECS Transactions
SP - 393
EP - 398
BT - Semiconductor Wafer Bonding 12
PB - Electrochemical Society Inc.
T2 - 12th International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications - ECS Fall 2012 Meeting
Y2 - 7 October 2012 through 12 October 2012
ER -