Abstract
Wafer direct bonding is a technique for integration of dissimilar materials without any adhesives. This technique is applied to the bonding between III-V compound semiconductors and garnet crystals, to integrate a laser diode and an optical isolator. The isolator is contacted with the terraced laser diode by wafer bonding and heat treatment in hydrogen ambience.
| Original language | English |
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| Number of pages | 1 |
| Publication status | Published - 2000 Jan 1 |
| Externally published | Yes |
| Event | 2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000) - Nice, France Duration: 2000 Sept 10 → 2000 Sept 15 |
Other
| Other | 2000 Confernce on Lasers and Electro-Optics Europe (CLEO 2000) |
|---|---|
| City | Nice, France |
| Period | 00/9/10 → 00/9/15 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Electrical and Electronic Engineering