TY - JOUR
T1 - Interface characteristics of β-Ga2O3/Al2O3/Pt capacitors after postmetallization annealing
AU - Hirose, Masafumi
AU - Nabatame, Toshihide
AU - Irokawa, Yoshihiro
AU - Maeda, Erika
AU - Ohi, Akihiko
AU - Ikeda, Naoki
AU - Sang, Liwen
AU - Koide, Yasuo
AU - Kiyono, Hajime
N1 - Funding Information:
This work was supported by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) “Program for research and development of next-generation semiconductor to realize energy-saving society” (No. JPJ005357). This work was partially supported by Japan Society for the Promotion of Science (JSPS) KAKRNHI (Grant No. JP20H02189). Part of this work was performed under the Cooperative Research Program of Joining and Welding Research Institute, Osaka University. The authors wish to thank the members of the nanofabrication group of the National Institute for Materials Science for their support during this study.
Funding Information:
This work was supported by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) "Program for research and development of next-generation semiconductor to realize energy-saving society" (No. JPJ005357). This work was partially supported by Japan Society for the Promotion of Science (JSPS) KAKRNHI (Grant No. JP20H02189). Part of this work was performed under the Cooperative Research Program of Joining and Welding Research Institute, Osaka University. The authors wish to thank the members of the nanofabrication group of the National Institute for Materials Science for their support during this study.
Publisher Copyright:
© 2020 Author(s).
PY - 2021/1/1
Y1 - 2021/1/1
N2 - Interface characteristics of frequency dispersion, flatband voltage (Vfb) shift, fixed charge (QIL), and interface state density (Dit) in β-Ga2O3/Al2O3/Pt capacitors were investigated after postmetallization annealing (PMA) at 300 °C in N2 using a conductance method and a photo-assisted capacitance-voltage technique. After PMA, no frequency dispersion was observed, and the QIL and Dit values related to interface states near the conduction band edge (Ec) were significantly reduced to the ranges of -4 to +1 × 1011 cm-2 and 3 to 8 × 1011 cm-2 eV-1 at Ec - E = 0.4 eV, respectively, in the capacitors subjected to a low postdeposition annealing (PDA) temperature region of 300-600 °C. In contrast, a large frequency dispersion, and high QIL (-2 × 1012 cm-2), and Dit (4-5 × 1012 cm-2 eV-1 at Ec - E = 0.4 eV) of the capacitors with a high PDA temperature region of 700-900 °C remained. This difference is considered to be due to hard structural changes at the multilayer level by the interdiffusion of Ga and Al at the β-Ga2O3/Al2O3 interface caused by PDA above 700 °C. In contrast, the average Dit values due to the electrons deeply trapped below the midgap between 2.6 and 3.3 eV decreased from 2 × 1012 to 1 × 1011 cm-2 eV-1 as the PDA temperature was increased from 300 to 900 °C, respectively, before PMA. No significant change in Dit below the midgap was observed, regardless of the PDA temperature after PMA. Note that the PMA treatment effectively improved only the interface properties near the Ec after treatment in the low PDA temperature region below 600 °C.
AB - Interface characteristics of frequency dispersion, flatband voltage (Vfb) shift, fixed charge (QIL), and interface state density (Dit) in β-Ga2O3/Al2O3/Pt capacitors were investigated after postmetallization annealing (PMA) at 300 °C in N2 using a conductance method and a photo-assisted capacitance-voltage technique. After PMA, no frequency dispersion was observed, and the QIL and Dit values related to interface states near the conduction band edge (Ec) were significantly reduced to the ranges of -4 to +1 × 1011 cm-2 and 3 to 8 × 1011 cm-2 eV-1 at Ec - E = 0.4 eV, respectively, in the capacitors subjected to a low postdeposition annealing (PDA) temperature region of 300-600 °C. In contrast, a large frequency dispersion, and high QIL (-2 × 1012 cm-2), and Dit (4-5 × 1012 cm-2 eV-1 at Ec - E = 0.4 eV) of the capacitors with a high PDA temperature region of 700-900 °C remained. This difference is considered to be due to hard structural changes at the multilayer level by the interdiffusion of Ga and Al at the β-Ga2O3/Al2O3 interface caused by PDA above 700 °C. In contrast, the average Dit values due to the electrons deeply trapped below the midgap between 2.6 and 3.3 eV decreased from 2 × 1012 to 1 × 1011 cm-2 eV-1 as the PDA temperature was increased from 300 to 900 °C, respectively, before PMA. No significant change in Dit below the midgap was observed, regardless of the PDA temperature after PMA. Note that the PMA treatment effectively improved only the interface properties near the Ec after treatment in the low PDA temperature region below 600 °C.
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U2 - 10.1116/6.0000626
DO - 10.1116/6.0000626
M3 - Article
AN - SCOPUS:85097334222
SN - 0734-2101
VL - 39
JO - Journal of Vacuum Science and Technology A
JF - Journal of Vacuum Science and Technology A
IS - 1
M1 - 012401
ER -