Abstract
An inverted microstrip line IC structure for ultra high-speed applications is proposed. It allows a very low-parasitic-impedance module with a flip-chip bonding, a small IC size, and performance improvements for high-speed digital ICs.
Original language | English |
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Pages (from-to) | 1643-1646 |
Number of pages | 4 |
Journal | IEEE MTT-S International Microwave Symposium Digest |
Volume | 3 |
Publication status | Published - 1995 Jan 1 |
Event | Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA Duration: 1995 May 16 → 1995 May 20 |
ASJC Scopus subject areas
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering