Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC

Hitoshi Tsuchiya; Tetsuya Homma

doi:10.1007/s10043-015-0032-6

Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC

Research output: Contribution to journal › Article › peer-review

Abstract

We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.

Original language	English
Pages (from-to)	1-8
Number of pages	8
Journal	Optical Review
Volume	22
Issue number	1
DOIs	https://doi.org/10.1007/s10043-015-0032-6
Publication status	Published - 2015 Feb 1

Keywords

Galvano motor
Laser beam scanning
Laser soldering
Quad flat package (QFP)
Yttrium aluminum garnet (YAG) laser

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics

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10.1007/s10043-015-0032-6

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title = "Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC",

abstract = "We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.",

keywords = "Galvano motor, Laser beam scanning, Laser soldering, Quad flat package (QFP), Yttrium aluminum garnet (YAG) laser",

author = "Hitoshi Tsuchiya and Tetsuya Homma",

note = "Funding Information: This work was supported by Toshiba Corporate Manufacturing Center. Publisher Copyright: {\textcopyright} 2015, The Optical Society of Japan.",

year = "2015",

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doi = "10.1007/s10043-015-0032-6",

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AU - Tsuchiya, Hitoshi

AU - Homma, Tetsuya

PY - 2015/2/1

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N2 - We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.

AB - We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.

KW - Galvano motor

KW - Laser beam scanning

KW - Laser soldering

KW - Quad flat package (QFP)

KW - Yttrium aluminum garnet (YAG) laser

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Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC

Abstract

Keywords

ASJC Scopus subject areas

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