Low-cycle fatigue properties of eutectic solders at high temperatures

Yoshiharu Kariya, Tadatomo Suga

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)


This paper details the deformation mechanism and low-cycle fatigue life of eutectic solder alloys at high temperature (around 0.8 Tm). Grain boundary sliding generally nucleates a wedge-type cavity that reduces the low-cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn-Ag-Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb-Sn and Bi-Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low-cycle fatigue endurance for theses eutectic Pb-Sn and Bi-Sn alloys.

Original languageEnglish
Pages (from-to)413-419
Number of pages7
JournalFatigue and Fracture of Engineering Materials and Structures
Issue number5
Publication statusPublished - 2007 May


  • Creep
  • Grain boundary sliding
  • Lead-free solder
  • Low-cycle fatigue
  • Miniature testing
  • Sn-3.0Ag-0.5Cu
  • Sn-37Pb
  • Sn-57Bi

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering


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