Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

Yoshiharu Kariya, Tomokazu Niimi, Tadatomo Suga

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	1-6
Journal	Proceedings of ASME International Electeronics Packing Technical Conference
Volume	73165
Publication status	Published - 2005 Jul 20

Cite this

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title = "Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen",

author = "Yoshiharu Kariya and Tomokazu Niimi and Tadatomo Suga",

year = "2005",

month = jul,

day = "20",

language = "English",

volume = "73165",

pages = "1--6",

journal = "Proceedings of ASME International Electeronics Packing Technical Conference",

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TY - JOUR

T1 - Low Cycle Fatigue Propreties of Solder Alloys Evaluated by Micro Bulk Specimen

AU - Kariya, Yoshiharu

AU - Niimi, Tomokazu

AU - Suga, Tadatomo

PY - 2005/7/20

Y1 - 2005/7/20

M3 - Article

VL - 73165

SP - 1

EP - 6

JO - Proceedings of ASME International Electeronics Packing Technical Conference

JF - Proceedings of ASME International Electeronics Packing Technical Conference

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